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Final Test Solution Highlights

Putting together innovative application specific technologies, Test21 solution based test products are paving ways into tomorrow's  landscape

Never to early for tomorrow's technology

 

Putting together innovative application specific technologies, Test21 solution based test products are paving ways into tomorrow's  landscape

Automotive

Qtrek Technology for tri-temp mass production. Patented thermal control and isolation design, effectively minimizes thermal gradient between DUT, handler, test socket and loadboard. Qtrek controller intelligently regulates test hardware temperature to within 1°C.

Together with Automotive Grade 0 PCB and Socket products, this is the unicorn of all tri-temp testing.

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Device Thermal Management

Yukon and Heater systems integrate seamlessly onto any test hardware, perfect for today's hand test and bench applications.

 

From -40°C to 200°C, no CDA, no nitrogen, no 220VAC.

On-board Flash and DDR Memory

Flashback, an at DUT high performance memory stacking system, allowing high density memories placed directly under each test socket. Multi-site memory connection is no longer a bottle neck in any production setup.

Dynamic Ultra High Current PDN

Spice and CPM (Chip-Power-Model) aware PI analysis, focusing on pattern based voltage and current stability. Device package, test socket, loadboard and decoupling modeling co-simulation, in depth study of power network worst case margin.

PMIC

T-Grid system realizes practical universal, reusable loadboards for mass production. Device pitch expansion technology dramatically eliminates need for high aspect ratio loadboard. Dynamic and static power integrity plus transient simulation keep power delivery network inductance under check.

RF In-socket Front-ends

T-grid's in-socket pcb substrate allows system-level DUT component placement at final test. RF front-ends, tune circuits and even coaxial launchers fits comfortably inside T-grid test socket. 

SERDES, High Performance, High Density SOC​

Speedback is our latest vertically integrated wide-band circuitry expansion platform. Every single critical component can now fit comfortably around DUT without compromises. Speedback has your back covered!

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